Customization: | Available |
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CAS No.: | 25067-11-2 |
Formula: | (-CF2-CF2-)n(-CF2CF(CF3)-)m |
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Grade |
MFR (g/10 min) |
Melting Point °C (°F) ASTM,D4591/D3418 |
Features |
Applications |
General-Purpose |
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100 |
7 |
260 (500) |
General- purpose resin with medium melt flow rate |
|
106 |
100 |
255 (491) |
High productivity grade |
|
Improved Stress Crack Resistance |
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9302 |
255 |
260 (500) |
Good viscosity, highest degree of stress crack resistance |
|
CJ95 |
5 |
255 (491) |
Low MFR, higher degree of stress crack resistance |
|
CJ99 |
9 |
255 (491) |
High degree of stress crack resistance |
|
Superior Electrical Properties |
||||
9494 |
30 |
255 (491) |
Improved dissipation factor at high frequencies. Significant plateout resistance in melt extrusion |
|
9495 |
30 |
255 (491) |
High speed, premium resin with improved adhesion to copper wire |
|
9835 |
20 |
255 (491) |
Medium melt flow resin with improved adhesion to copper wire under specific wireline process conditions |
|
9898 |
30 |
255 (491) |
Best-in-class dissipation factor at high frequencies (>10 GHz). Significant plateout resistance in melt extrusion |
|
Specialty |
||||
9819FL |
30 |
255 (491) |
Specialty resin available as loosely compacted fluff |
|