Description:
AvaSpire AV-621 is an unreinforced PAEK that offers improved ductility and impact strength relative to PEEK while retaining most of the key performance attributes of PEEK.The AV-621 grade is the low melt flow (higher molecular weight) analogue of the medium flow grade AvaSpire AV-651 that is tailored primarily for injection molding applications as well as film extrusion. AvaSpire AV-621 resin is suited for a variety of processing methods including compression molding, stock shape extrusion, as well as injection molding. AvaSpire AV-621 has been formulated for applications requiring a balance of chemical resistance and mechanical strength along with good part aesthetics, thereby bridging the performance gaps within the ultra polymers space. These and other properties make this resin well-suited for applications in healthcare, transportation, semiconductor, electronics, chemical processing, and other industries. AvaSpire AV-621 is easily fabricated using conventional thermoplastic melt processing techniques and standard equipment.
AvaSpire AV-630 is an unreinforced PAEK developed as an alternative to low melt flow PEEK for the extrusion of ultra-thin films. Films with thicknesses as low as 0.2 mils (5 microns) can be successfully melt extruded out of AV-630 using conventional thermoplastics film extrusion equipment. Films of AV-630 offer certain performance advantages over comparable PEEK film. These include improved toughness and ductility, a higher retention of mechanical integrity at temperatures above 150°C, better acceptance of adhesives and improved flame propagation resistance properties. Ultra-thin films (<15 microns thick) also exhibit a more flexible, less crinkly feel than that of PEEK films at comparable thicknesses. Sub-mil thick films produced from AV-630 can be utilized in a wide range of industrial applications. Typical applications include capacitors, electrical insulation, flexible circuitry substrates, composite film layers, specialty laminates, good flexibilities, liners and aerospace films, such a thermal acoustical insulation blanket bagging materials.
AvaSpire AV-651 is an unreinforced PAEK that offers more ductility and impact strength than PEEK, with higher chemical and environmental stress cracking resistance than AvaSpire AV-650. It has been specifically formulated for applications requiring a balance of chemical resistance and mechanical strength along with good part aesthetics, bridging the performance gaps within the ultra polymers space. These properties make it well-suited for applications in healthcare, transportation, electronics, chemical processing and other industrial uses. AvaSpire AV-651 can be easily processed by typical injection molding and extrusion methods using conventional processing equipment.
AvaSpire AV-848 is a high-temperature PAEK that offers several key performance advantages over comparable grades of PEEK above 150°C, including better dimensional stability, lower CLTE from 150°C to 240°C, and lower modulus for greater flexibility at room temperature. Processing: Extrusion Blow Molding; Fiber (Spinning) Extrusion; Film Extrusion; Injection Blow Molding; Injection Molding; Machining; Profile Extrusion; Thermoforming; Wire & Cable Extrusion Key Attributes: Chemical Resistant; Ductile; Fatigue Resistant; Flame Retardant; Good Dimensional Stability; Good Impact Resistance; High Heat Resistance
Overview:
AvaSpire PAEK is a family of high-performance between PEEK and other high-performance polymers. For example, ductility and toughness can be significantly improved versus comparable grades of PEEK, delivering 20% higher tensile elongation at yield and doubled tensile elongation at break values.
Depending on the grade, AvaSpire PAEK outperforms comparable grades of PEEK.
Higher stiffness from 150 °C to 190 °C (302 °F to 374 °F) Improved ductility and toughness Equal or better chemical resistance UL-94 V0 rating at 0.8 mm Comparable strength and stiffness at up to 30% lower cost Excellent aesthetics and colorability
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